Kingston Technology KSM26RD8/16HDI memory module 16 GB 1 x 16 GB DDR4 2666 MHz ECC
- 16 internal banks
- Bank Grouping is applied, and CAS to CAS latency (tCCD_L, tCCD_S) for the banks in the same or different bank group accesses are available
- Bi-Directional Differential Data Strobe
- 8 bit pre-fetch
- Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop)
- Supports ECC error correction and detection
- On-Die Termination (ODT)
- Temperature sensor with integrated SPD
- This product is in compliance with the RoHS directive
- Per DRAM Addressability is supported
- Internal Vref DQ level generation is available
- Write CRC is supported at all speed grades
- CA parity (Command/Address Parity) mode is supported
Kingston’s KSM26RD8/16HDI is a 2G x 72-bit (16GB) DDR4-2666 CL19 SDRAM (Synchronous DRAM) registered w/ parity, 2Rx8, ECC, memory module, based on eighteen 1G x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-2666 timing of 19-19-19 at 1.2V. Each 288-pin DIMM uses gold contact fingers.
| Features |
| JEDEC standard |
Yes |
| Programming power voltage (VPP) |
2.5 V |
| Row active time |
32 ns |
| Refresh row cycle time |
350 ns |
| Row cycle time |
46.25 ns |
| Module configuration |
2048M x 72 |
| Memory voltage |
1.2 V |
| CAS latency |
19 |
| ECC |
Yes |
| Memory form factor |
288-pin DIMM |
| Component for |
PC/Server |
| Memory clock speed |
2666 MHz |
| Internal memory type |
DDR4 |
| Memory layout (modules x size) |
1 x 16 GB |
| Internal memory |
16 GB |
| Operational conditions |
| Storage temperature (T-T) |
-55 – 100 °C |
| Operating temperature (T-T) |
0 – 85 °C |
| Technical details |
| Compliance certificates |
RoHS |
| Weight & dimensions |
| Height |
31.2 mm |
| Width |
133.3 mm |
| Logistics data |
| Harmonized System (HS) code |
84733020 |
